Ningmu Zou

Ningmu Zou

Ningmu Zou

Associate Professor of School of Integrated Circuits

邹宁睦，国家级青年人才，南京大学集成电路学院副教授、姑苏青年教授，博士生导师。2011年本科毕业于南京大学，后获得美国佐治亚理工学院计算机科学硕士和康奈尔大学光学工程博士学位。2017-2023年担任美国AMD半导体公司主任工程师、美国德克萨斯州立大学电子工程系客座教授。近年来研究针对人工智能驱动的集成电路STCO，缺陷检测及良率提升，光电集成芯片设计优化方法，组织构建了世界领先水平的企业级智能化芯片制造感知大数据系统。

邹博士曾在Nature、Nature子刊等期刊发表学术论文30余篇，授权专利14项。近五年来，获得过2024年世界制造工程协会“杰出青年制造工程师奖”（SME Outstanding Young Manufacturing Engineer Award，当年中国大陆地区高校唯一获奖者),2022年“全美十大华人杰出青年”称号，AMD全球研发大会最佳论文奖，AMD亚洲研发大会最佳创新奖，两次获得AMD Annual Executive Spotlight Award，多次获得AMD企业创新奖，此外还获得过2022年中国仪器仪表学会技术发明一等奖、2022年中国光电工程学会“金燧奖”、2023年中国安装协会科学技术进步一等奖等奖项，同时担任过Photonics Asia, IEEE VLSI, ISTFA等多个国际会议学术委员会委员。

Dr. Ningmu Zou is an associate professor at the School of Integrated Circuits at Nanjing University. Before joining academia, he served as a staff engineer at AMD Inc. for six years. Dr. Zou earned his Ph.D. in 2017 from Cornell University, where he specialized in advanced integrated circuit manufacturing and artificial intelligence applications. Dr. Zou's research focuses on the development and deployment of artificial intelligence algorithms in advanced semiconductor manufacturing. His contributions include pioneering machine learning models and big data analytics techniques for optimizing photolithography processes, enhancing near-field optical proximity correction, improving device yield and performance, and advancing chip defect diagnosis and classification. These innovations have significantly expanded the role of artificial intelligence in chip manufacturing and enabled the creation of a globally recognized enterprise-level intelligent chip manufacturing perception and big data system.

Teaching

  • Digital Signal Processing (2024 Spring)
  • Integrated Circuits Manufacturing Technology (2024 Fall)